India Signs Loan Agreement with World Bank for US $119 Million
Posted on:08 Nov 2017 15:20:23
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08 November 2017 Current Affairs: A Financing Agreement for IBRD loan of US$ 119 million (equivalent) for the “Odisha Higher Education Programme for Excellence & Equity (OHEPEE) Project” was signed with the World Bank.
The Objective of the project is to improve the quality of 'students’ equitable access to selected institutions and enhance governance of the higher education system in Odisha.
The closing date for the project is 30th November, 2022.
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